China sputtering target Manufacturers Factory Suppliers
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Titanium Planar Sputtering Target MaterialProduct Name: Titanium Planar Sputtering Target Materialread more
Diameter Range: Ø30-2000 mm
Thickness Range: 3.0-300 mm
Plate Dimensions: Length: 200-500 mm, Width: 100-230 mm,... -
Tungsten Sputtering Target MaterialProduct Name: Tungsten Sputtering Target Materialread more
Packaging: Wooden crates, or as per customer requirements
Marking: Laser marking available upon completion -
Molybdenum Sputtering Target MaterialProduct Name: Molybdenum Sputtering Target Materialread more
Packaging: Wooden crates, or as per customer requirements
Marking: Laser marking available upon completion -
Titanium Tungsten Alloy Sputtering Target MaterialProduct Name: Titanium Tungsten Alloy Sputtering Target Materialread more
Diameter: 10-300 mm
Thickness: 2-6 mm
Dimensions: Custom specifications available
Processing: Forging,... -
Titanium-aluminum Alloy Sputtering Target MaterialProduct Name: Titanium-Aluminum Alloy Sputtering Target Materialread more
Packaging: Wooden crates, or as per customer requirements
Marking: Laser marking available upon completion -
Titanium Rotating Sputtering Target MaterialProduct Name: Titanium Rotating Sputtering Target Materialread more
Standards: ASTM B337, ASTM B338, ASTM B861
Materials: High Purity (99.5%, 99.99%, 99.995%), Grade 1, Grade 2, Ti-6Al-4V... -
Titanium Sputtering Target MaterialProduct Name: Titanium Sputtering Target Materialread more
Standards: ASTM B265, ASTM B348
Materials: Gr2, 99.9%, 99.99%
Packaging: Wooden crates, or as per customer requirements...
WebSputtering Targets Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can...
WebMagnetron sputtering is a deposition technology involving a gaseous plasma which is generated and confined to a space containing the material to be deposited – the ‘target’. The surface of the...
WebSputtering Targets KDF offers a large selection of high purity metals, alloys, non-metallic and cermets for virtually every sputtering and evaporation application in the industry. KDF’s facility...
WebThe exposed surface of the cathode is called the sputtering target. The mechanism was first discovered in 1852, and developed as a thin film deposition technique by Langmuir in 1920. Sputtering...
WebLanthanum boride sputtering targets have been used in the coating of electronic components. 17 2021-08 Aluminum scandium alloy sputtering target The strength, hardness, weldability and corrosion...
WebIn physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or...
